Talented people come out from generation to generation, each leading the way for hundreds of years. There is a great engineer who once led the research and development of Huawei HiSilicon chips, laid the foundation for Huawei’s rapid advancement in the chip field, and made HiSilicon chips famous all over the world and applied to various product lines. He is the former chief architect of Huawei HiSilicon Semiconductor- David.
To greatly improve Limee’s R&D strength in the communications field, to be at the forefront of the industry, and to lead the industry trend, David, a former Huawei engineer who has reached the pinnacle, is specially introduced as Limee’s optical network specialist. The joining of David has greatly strengthened Limee’s technical skills, coupled with the elites with more than n 10 years of R&D experience in the communication field, Limee’s comprehensive R&D strength has been further improved, and XGSPON OLT, WIFI 6 AX3000 ONT, AX1800 Router and other trending products has been launched successively，make Limee far ahead of its competitors. We also hope that more and more people with lofty ideals and excellent engineers will join the Laimi team, so as to strengthen the Laimi team, bring more trend and good products, and create more value for customers.
Background Introduction:
2011-2018 Chief Software Architect of Shenzhen Hisilicon Semiconductor Technology Co., Ltd.
Master of software, 16 years of working experience in the world’s top 500, experienced developers, excellent project managers, system engineers, chief system engineers, product managers, chip chief software architects, and CEO of start-up companies in multiple R&D and management positions. Participate in the company’s research and development of IPD and CMM process changes. Proficient in C language, proficient in Linux, proficient in embedded device development, proficient in IPD project management, CMM quality development model, proficient in product life cycle management, proficient in architectural system software platform, proficient in demand identification, decomposition, and distribution.
Post time: Jan-11-2023
